TECHNICAL SKILLS

• Allegro to 17.2, Design Entry (OrCAD) and CAM350.
• Mentor PADS, P - CAD, Polar Instruments, MS Project, Visio, MS Office and Agile
• Basic understanding of lab equipment, microscopes, DMM, Oscilloscope, power supplies, calipers, soldering and de-soldering stations and various other lab equipment.

PROFESSIONAL EXPERIENCE

Confidential

VP of Product Development

Responsibilities:

• Identify consumer Products that showcase Confidential product
• Budget planning
• Work with CMs to improve yield and quality
• Substrate design and DFM reviews
• Improved product reliability and substantially reduced field failures and returns
• Develop new products within the market space
• Work with other start - up companies to embed the Confidential product within their designs
• Invented the spring contact used on all of the company products
• Component Engineering
• Supply Chain Management
• PLC
• DFx

Confidential

Director

Responsibilities:

• Improve internal design process
• Manage a team of engineers in China and Taiwan
• PCBs, FPCs and RFPCs for camera modules and test
• Implemented a Substrate IQC process and documentation
• Standardize Drawings
• Implemented an internal design review process
• Meet with US based customers to review product designs
• Work with suppliers to reduce cost and improve yield
• Substrate stackup design

Confidential

Sr Director

Responsibilities:

• Develop relationships with Tier 1 Asia substrate fabricators
• Design of LED backlighting substrates and display products
• Investigate alternative designs to reduce cost and improve yield
• Implemented a substrate design and review process
• Standardized Drawings and notation
• Work with jig designers to improve throughput
• Review all DFMs
• Substrate Stackup design

Confidential

Sr. Director

Responsibilities:

• Fully equip camera module and image science labs
• Budget planning for up to three years
• Design FPCs, RFPCs, PCBs and ceramic substrates for camera modules and other products
• Work with suppliers to reduce cost
• Arrange calibration and service contracts for lab equipment, including SEM and CT-Scan in other company owned labs
• Work directly with customers from concept to Mass Production
• Reduced time for camera module prototype turn around
• Weekly staff meetings to keep all stakeholders informed and work through issues
• Support several other sites with design expertise as needed
• Review all factory and supplier DFMs
• Responsible for Substrate Technology Roadmap
• Develop Product sample kits for Sales and Marketing
• Develop advanced packaging concepts into HVM capable designs.
• Worked with internal lawyers to review competitive products for potential patent violations
• Hire and manage additional engineering personnel in China and Taiwan design centers
• Component Engineering
• Supply Chain Management
• Six Sigma

Confidential

Sr. Global PCB Design Manager

Responsibilities:

• Improve existing design and review processes
• Design FPCs, RFPCs, PCBs and ceramic substrates for camera modules and other products
• Substrate Stackup Design
• Reduced time for camera module prototype turn around
• Support several other sites with design expertise as needed
• Review all internal factory and substrate supplier DFMs
• Responsible for Substrate Technology Roadmap
• Develop advanced packaging concepts into HVM capable designs.
• Management of a Global substrate design team spanning four countries
• Work with suppliers to reduce cost PLC
• Budget Planning Laboratory Management

Confidential

Technical Staff

Responsibilities:

• Implement drawing standards and design processes
• Design of power distribution PCB and massively parallel computer main PCB
• Clean up existing CAD library
• Bring in off-shore CMs
• Review all internal factory and substrate supplier DFMs

Confidential

Sr. PCB Design Engineer

Responsibilities:

• Improve existing design and review processes
• Design of all life support PCBs and sleep apnea product PCBs
• Upgrade the CAD system and flow at this site
• Review all internal factory and substrate supplier DFMs
• Develop advanced packaging concepts into HVM capable designs.
• Management of a Global substrate design team spanning four countries
• Component Engineering
• PCB stackup

Confidential

Sr. PCB Design Engineer

Responsibilities:

• Implement drawing standards and design processes
• Design of 40GHz optical transponder PCB and various development PCBs up to 10GHz
• Create a CAD library
• Chair design reviews
• PCB Material Stackup

Confidential

Program Manager

Responsibilities:

• IC floorplan
• Create a CAD library
• Manage engineering office
• Keep track of project progress and address issues
• Supply Chain Management

Confidential

Sr. PCB Engineer

Responsibilities:

• Responsible for all aspects of PCBs (design, fabrication and assembly)
• Define CAD process flow
• Review all PCB supplier DFMS
• PCB Stackup
• Chair Design Reviews
• Component Engineering
• Program Management
• PLC

Confidential

Sr. CAD Engineer

Responsibilities:

• Component Engineering
• Create Source Control Drawings

Confidential

PCB Engineer and Program Manager

Responsibilities:

• PCB development for an External Cartridge HDD
• Program management for other models
• PLC
• Managed prototype build to HVM transfer
• Yield improvement
• Cost reduction