TECHNICAL SKILLS
- CCD sensor Development
- High Speed Camera Design
- Analog
- High - Speed
- RF circuit design
- PCB board design
- Project Management
- System Architecture
PROFESSIONAL EXPERIENCE
Principal Electronic Engineer, Sr. System Engineer
Confidential
Responsibilities:
- Designed 6 the more advanced CCD sensor packages, 5 of them are MCM modules
- Participated 3 ASICs design and Evaluation. Two multiple channel ADCs and One clock drives
- Designed more than 10 PCB for Confidential inspection system
- Architect 5 image acquisition system for Confidential inspection system.
- Defined function blocks and architecture.
- As the key technical contributor, I actively participated in spec definition, high level function block design, design review, system integration with sensor and ASICs, MCM package design (TDI Sensor + ADC Package) and performance evaluation. Finally, delivered reference design and operation guide.
- Worked with vendor to define Confidential specification, to develop evaluation board, and to evaluate performance.
- These drivers enable sensors to operate at very high speed. After second re-spin, the chips have been used in multiple Confidential products
