SUMMARY

• A Lead Hardware Design Engineer role where my creative problem solving capabilities, technical experience, electronic, hardware and programming knowledge can be use effectively to improve operations and contribute to company profits.
• Extensive experience in design, analysis, testing and debugging analogue, mixed analogue/digital signal, digital and RF circuitry backed by numerous projects completed.
• Very low noise amplifiers, high stability oscillators, frequency synthesisers (PLL and DDS), mixers, RF switchers, high linearity power amplifiers.
• Couplers, circulators, impedance transformers
• Stripline and microstrip, transmission lone, impedance matching
• Multipath and line of sight propagation, signal to noise ratio (SNR), sensitivity.
• Modulation/demodulation techniques: FHSS, DSSS, FSK, PSK, OFDM, MSK, QAM, AM, SSB, FM, PM, TDMA, QPSK, QAM
• Wireless protocols: 802.11x, 802.16x, CDMA, W - CDMA, GPS, GSM, Bluetooth, Zigbee, Wimax, LTE, 5G, IOT
• Satellite communication: ARGUS, GOES, GPS
• RFID tags used for wildlife monitoring and container tracking.
• ADS, HFSS, Sonnet, ADS Genesys, PSpice, Microwave Office, MMICAD, Cadence Allegro, Cadence ORCAD - schematic and layout, Protel DXP
• Strong expertise in digital design and testing
• Microprocessors: PowerPC, Confidential, ARM, Tensilica RISC
• Microcontrollers: Atmel, TI, PIC, Freescale, Hitachi
• CPLD, FPGA design test and debug
• Serial interfaces and communication protocols: RS232, RS485, I2C, SPI, SMB, USB, DS3, T1, Ethernet: 10T, 100T, 1000T, 10GE, 100GE, 40GE, IEEE802.3bj, IEEE802.3bs PCI Express, M.2, mSATA.
• Parallel interfaces and communication protocols: PCI, PICx, IDE, GPIB (IEEE488), EPP, IEEE1284.
• Optical communication: OC-3, OC-12, OC-96, OC192, Fiber Channel
• Efficient in designing using basic digital components: gates, flip-flops, registers, multiplexers, latches, counters in different types of logic - ECL, PECL, SSTL, LVPECL, LVDS, CML, TTL, CMOS.
• Good knowledge of VHDL and Verilog used for PLD/FPGA design and debugging
• Good knowledge of assembly, C++, Perl, python.
• Strong expertise in High Speed Digital Design and Signal Integrity
• Design, simulation and characterisation for: PCIX, PCI, PCI Express, Fiber Channel, SAS, SATA, XAUI, DDR, LVDS, GPIO, DDR, DDR2, DDR3, DDR4, SDRAM, flash, USB, SPI, Ethernet 10T, 100T 1000T, Infiniband;
• IBIS model creation for single and differential ended I/O’s
• BER, jitter, eye diagram, crosstalk characterisation, clock distribution
• Model correlation and timing analysis
• S-parameters for line and circuit modelling and signal integrity simulation
• Characterisation of transmission lines, terminations, vias, connectors and discontinuities
• Cadence SI (SpectraQuest), Cadence SPB, HFSS, HSPICE, Hyperlynx, Timing designer, Cadence Virtuoso, XTK, PADS, ADS, Quantum SI, Sigrity
• TDR, Network Analyser Oscilloscopes, Logical analysers, Spectrum analysers.
• Strong expertise in analogue design and testing:
• Very low noise amplifiers, oscillators, active and passive filters, peak detectors, PLL, power amplifiers class A, B, AB, C, D, E and F.
• Switch mode and linear power supplies, hot-swap circuitry, redundant power supplies.
• Power management for battery power devices.
• PSpice, PCAD, ORCAD, Alegro, Eagle, Protel, PADS, LabView, MathLab, MathCAD.
• Engineering documentation: design requirements, design specification, verification plan and verification report

PROFESSIONAL EXPERIENCE

Freelancer

Confidential

Responsibilities:

• Storage/black box for aerospace industry
• Signal integrity for PCI Express gen2 and 3, SAS/SATA2
• SSD M.2 SATA and M2 NVMe; mSATA; SAS and SATA drives
• Interfacing with server board, DDR3 memories, FLASH, I2C and SPI interfaces
• Power supplies and power sequencing, Clock distribution and synchronization
• SI link budget and stack-up recommendation
• Robot arm central control unit
• Design based on Confidential Atom Z8350 Cherry Trail
• Designed with: DDR3L, HDMI, USB host and OTG, MIPI, eMMC;
• Power supplies and distribution, start-up and shut down sequencing
• Battery charging circuitry for different battery chemistry
• Wireless powered sensor network for security/ surveillance application
• Various sensor networks (CO2, forced entrance, video surveillance, temperature, …) connected with a central processing unit
• Designed the central unit using an ARM processor,
• Designed the various sensors using microcontrollers for very low power consumption
• Defined the communication protocol and worked with the software team to implement it
• Research in wireless powering the sensors form various distances and location
• Designed the Tx and Rx for 13.5xMHz
• Warning system for sudden breaking or stop on auto vehicles
• Microcontroller based system with I2C busses for communication
• Bluetooth programming interface
• High power LED

Tools: used: Cadence, LTspice

Principal High Speed Design Engineer

Confidential

Responsibilities:

• Research and simulations in 112Gbps
• Signal modulation for 112Gbps and beyond, FEC requirements, channel requirements
• Lead passive channel specification and collaborate with interconnect vendors (TE, Molex, Amphenol) to deliver product meeting HW design specification for 112G NRZ operation.
• Channel: PCB materials (2nd and 3rd order effects, roughness, glass weave), PCB manufacturing process, cable, and connectors
• Driving chip vendors (HiSilicon) to deliver state-of-the-art SerDes architecture through signaling technology and equalizer to guarantee NRZ 112G-SR, NRZ 56G-MR, and PAM-4 56G-LR operation with good BER with and without FEC.
• Massive MIMO system design
• Worked with suppliers: internal and external to define and research the options in designing Massive MIMO systems for 5G
• Worked with thermal and mechanical teams to establish the best tradeoff between electrical, thermal and mechanical design to meet the client requirements
• Worked with university teams in Europe to define and manage research projects for achieving best solution in algorithms; materials and components
• Mentored and supervised a team of board engineers
• High power 5G Massive MIMO
• Lead passive channel specification and collaborate with interconnect vendors (TE, Molex, FCI, Amphenol) to deliver product meeting HW design specification for 56G operation.
• Driving interconnect vendors (Amphenol, Tyco, TE, Molex, FCI) and PCB manufacturing vendors (Amphenol, Sanmina, WUs, TTM, Toppan, ISU, Multek-Germany), material vendors (Isola, Panasonic, ITEQ) to deliver high data rate channels with reasonable cost.
• Investigated the possibility to have 100Gbps on one differential pair on a low-cost PCB
• Investigate different possible modulation schemes and error correction schemes for improving the performance of the system
• Defined the layout guidelines, PCB stack-up, component placement, component selection for this project
• Worked with the CPRI standardization team on defining CPRI 7.0
• Investigated the possibility to transmit CPRI over Ethernet
• Simulations for different data rates and PCB configuration
• Worked with ASIC team to define next generation ASIC
• System architecture and design for digital interfaces CPRI, JESD204B, DDR3
• Power delivery system design for a PCB the have peak power of 6kW and mean power of 0.4kW.

Tools: used: HFSS, Cadence SPB suite. Mentor Graphics, Microwave Office, ADS.

Staff Electronics Design Engineer

Confidential

Responsibilities:

• Proof of concept for 802.3bj long cables, check the maximum passive lengths
• Simulations for different dielectrics, gauge, drain wire/s
• Simulation for different metals and different plating
• Aim to build a passive zQSFP or QSFP28 over 7m
• Wireless or Ultrasound device to detect the presence of a person and if there are any issues.
• Based on a WiFi module/ultrasound device and on Doppler frequency changes in an enclosed space when an event occurs
• Proof of concept
• Design of wireless, ultrasound and digital modules
• Worked with customers to devise the best device for their needs
• Worked closely with manufacturing company to define the testing procedures for manufacturing and the optimization/elimination of yield
• Worked with mechanical contractor to design the enclosure as per client specification.

Tools: used: Cadence ORCAD and Allegro.

Lead Electronics Design Engineer

Confidential

Responsibilities:

• Pre and post layout signal integrity:
• Pre-layout simulations using HFSS and ADS to generate SI rules for XAUI, PCIe gen1,2, and 3, SATA, Infiniband.
• SI guidelines generation for system and boards
• Maximum/minimum trace length
• Maximum numbers of vias, back drilling layers, routing layers
• Link budget and specifications
• Stack-up generation
• Post layout system simulation and verification
• Backplane design for 28Gbps and aiming for
• Leading edge modeling and signal integrity for next generation design - 28 Gbps
• Worked with connector and ASIC manufacturers in defining and design of products for 28 Gbps backplanes and cards.
• New ideas for PCB manufacturing to eliminate losses at high data rates
• Worked together with PCB manufacturers to define new technologies and new materials
• Simulated and defined new pads and anti-pads for high speed signals in order to minimize losses and reduce cross-talk
• Software tools used: Cadence SPB 16.x suite for design, ADS, HFSS, HSPICE, Quantum-SI, SI800, CST Studio.

Hardware tools used: High Speed scope, TDR, logic analyzer, oscilloscope, traffic generator, VNA, DMM

Staff Electronics Design Engineer/Project Leader

Confidential

Responsibilities:

• Hub and remote backstation 2.3-2.8GHz and 3.3 - 3.9GHz frequency bands:
• Proof of concept
• Digital and RF architectural design
• Multi-processor design: 5 ARMS, 4 Tensilica and a NIOS
• Very low noise very high efficiency linear and switching power supplies, very low noise very low power losses linear supplies,
• Onboard communication using GMII interfaces
• Synchronization using 1588v2, SyncE and GPS
• Design for very low clock jitter, this include low noise power supplies, stack-up and routing management, low noise clock distribution system
• High speed digital design
• High linearity RF power amplifiers
• Designed MIMO RX and TX chains
• System design for achieving 256QAM 7/8; 1024 9/10.
• Compared with other competitors designs, tested the ideas and the functionality of different modules proposed improved designs or better options
• Designed for manufacturability and testing
• Selection of service providers and supply chain
• Hardware and software laboratory setup
• Interfaced with manufacturing for ICT design and improving the soldering process
• Interfaces with possible clients to get the product requirements

Software tools used: Cadence SPB 16.x suite for design and signal integrity, Altera Quartus, ADS.

Senior Signal Integrity Engineer/Senior Hardware Design Engineer

Confidential

Responsibilities:

• Taught electronics engineers how to design power supplies and the best approach for PCB design
• Responsible for multiple projects for servers/storage industry
• Designed 1U, 2U and 3U backplanes for server and appliance industry
• Designed appliances and RAID configured storage starting from Confidential server boards
• Designed SAS - SATA JBOD expanders for 12 and 16 drives including serial communications interfaces, switching power supplies and microcontroller circuitry
• Wrote engineering specification and test specifications
• Performed SI testing and verification of these designs
• Lab characterization and verification of: PCIX buses, DDR memory, fiber channel, SAS and SATA drivers;
• Simulations for stack up, trace lengths, EMI, impedance matching and timing analysis using Allegro PCB SI, Hyperlynx, HSPICE and HFSS for: PCIX, PCI Express, DDR, SAS and SATA signaling and fiber channel.
• Interfaced with clients to adapt the designs for their specific needs
• Designed for test and manufacturing
• Wrote routing guidelines for the PCB designer
• Worked with internal and external clients during the design phases to implement and adapt the designs for their specific needs

Signal Integrity Engineer

Confidential

Responsibilities:

• Characterized, tested and debugged multiple Confidential microprocessors for mobile industry: Hermone, Verde, Barracuda
• Created IBIS models for SATA and fiber channel I/O buffers using Analog Artist for simulations and IBIS Center for generating the model
• Signal Integrity - crosstalk, timing, EMI/EMC, transmission lines, discontinuities, power planes - for PCIX, PCI, DDR, USB, GPIO, LVDS using SpecctraQuest and Design Expert
• Generated models boards, via’s, packaging.
• Done correlation between IBIS model and HSPICE simulation.
• Signal integrity for SDRAM, microprocessors and optical RAM used in wireless industry.
• Performed simulations, worst case simulation with or without noise using e-designer and XTK, model fit of the results
• Lab verification for signal integrity

Senior Electronics Design Engineer

Confidential

Responsibilities:

• Trained engineers for best practice when design power supplies
• Designed acoustic to RF converter, stability +/- 0.5ppm frequency band 142 - 174 MHz, using DDS techniques
• Wrote firmware for ATMega microcontroller using a finite states machine.
• Wrote the program for the user interface
• Designer BPF 9th order for 142-174MHz and HPF for 50kHz
• Designed matching circuitry for interface between DDS and RF side and between RF side and antenna
• Designed RS232 to UART interface for 1.8 V
• Designed ISP programmer for 1.8V microcontroller
• Designed switching power supply from 11-16V to 1.8V, +/- 5V and +/-9V
• Designed communication modules for Argos Satellite, this implies a very low power consumption PLL, stability 0.2 ppb, variable phase modulator, Manchester encoding, very sharp bandwidth - 2kHz/ channel, very good stability over a wide range of temperatures, precise RTC.
• Designed frequency synthesizer’s - RF, analogue and digital as well as the firmware and front-end programming, stability less than 0.5 ppm, in 140MHz - 402MHZ band, based on DDS synthesis.
• Designed SEPIC switching power supplies for battery powered devices.
• Designed very low signal amplifiers for hydrophones, sensitivity 130dBm, noise level 9.5nV/Sqr(Hz), active BP, LP, HP filters in the 76-220 kHz frequency range.
• Designed low noise, high amplification, and low power consumption amplifiers for 148-152 MHz. Class C, E and F.
• Designed microstrip and coaxial dipole antenna for modem communications in 430-470 MHz band.
• Interfaced with clients to adapt the designs for their specific needs
• Worked with clients for develop new designs as per client specifications
• Designed the PCB for all the projects
• Project management for all of these designs.

Senior Hardware Design Engineer

Confidential

Responsibilities:

• Designed testing board for 0.5 - 3.2 Gbps Gandalf High Speed ASIC, with flexible interface (backplane, cables or optical modules), hot plug protection, monolithic PLL design, variable cable, trace length with selectable pre-emphasis
• Designed 2.5 Gbps optical transceiver module that was incorporated in DX 320 switch, responsible for electronics design, testing and simulation
• Tested, analyzed and improved for a noise-free (by improving the initial design) power delivery system of DX-140 switch; this involved process characterization/optimization, failure analysis, probe and test optimization, jitter analysis, noise analysis, testing for time and frequency domain, characterization of S-parameters and phase over frequency, eye diagram analysis
• Developed a new way for High Speed Digital power plane layout and decoupling using different types of capacitors which resulted in huge sales for Confidential
• Designed new testing procedures for Optera Connect DX according with ISO9001 and Confidential internal specifications
• PLL design for signal clock generator (SCG), delay lines for clock setup time
• In system testing and characterization for Optera Connect DX (this includes: bench testing, daisy chain shelf test with different patterns)
• Perform design verification tests to validate design requirements
• Cost reduction on DX140 switch
• Designed 150W (from 32-78 Vdc to 1.8, 3.3, ±5, ±12 Vdc) power supply for DX140, DX260, DX320, this include the inrush circuitry, voltage feedback and monitoring
• Power and analog circuitry for 4:1 combiner (four OC-48 to one OC192)
• Designed laser driver circuitry to maintain constant laser output power over full temperature range, design peak detectors, analog and digital laser bias circuitry
• Optimized PCB layout for RF performance with respect of the bandwidth of the digital signal, optimized the frequency response, minimum emissions for EMC/EMI compliance standards.
• Documentation for Design Specifications and Verification Report, ECR’s