SUMMARY:

• Creative, innovative Manufacturing Equipment Engineer with well - rounded experience in NPI, high volume manufacturing, medical devices, High-Vacuum systems, customer relations, and facilities-related equipment. Problem solver with reputation for consistently driving projects to successful conclusions. Ability to visualize complex 3-dimensional mechanical assemblies. Focused on design for manufacturability. Strengths include:
• Equipment design, upgrade, procurement, troubleshooting, reliability improvement and maintenance.
• New product introduction (NPI) and high volume product/process development.
• SolidWorks V14, Pro-Engineer, AutoCAD V12 mechanical CAD solid modeling.
• Medical FDA regulatory ISO13485 device and process development.
• Model maker, Tool and Die maker, CNC programmer, TIG welder, and sheet metal forming.
• Quality assurance, ISO9001, ISO13485,, GMP, advanced document control.
• High-Vacuum system design, assembly, troubleshooting, leak detection, field service and installation.
• Aerospace wiring harness design in conjunction with interpreting military specifications.
• Laser diode final test station, burn-in/accelerated life test systems design and characterization.
• Handling, transport, and monitoring of high pressure hazardous gasses and ultra-high explosives.

PROFESSIONAL EXPERIENCE:

Confidential, Sunnyvale, CA

Manufacturing Equipment Engineer

Responsibilities:

• Project team member for the installation of complete lamination system for 6 meter long flexible solar panels.
• Led 6 equipment maintenance technicians covering 24/7 manufacturing support.
• Laid out the new flexible solar panel manufacturing floor using AutoCad.

Confidential, Sunnyvale, CA

Equipment Engineer

Responsibilities:

• Updated production SolidWorks drawings and supporting production documents, MPIs, IQs, etc.
• Interacted with local machine shops to provide piece parts for assembly before transfer to Mexico.
• Supported clean room activities and production lines.

Confidential, Santa Clara, CA

Microelectronics Manufacturing Process Engineer

Responsibilities:

• Led NPI activities for robotic surgery camera modules then ramped up production from 30 to 400 units/month.
• Supported IPC-610 compliant surface mount assembly line and class 100 clean room activities.
• Integrated circuit package lead frame design and tooling design using SolidWorks and AutoCAD software.
• Implemented “MPulse” equipment preventative maintenance software system database.
• Laid out the new manufacturing floor using AutoCad.

Confidential, Menlo Park CA

Equipment Engineer

Responsibilities:

• Set up an ISO9001 preventive maintenance program.
• Decreased equipment downtime by redesigning critical systems.

Confidential, Hollister, CA

Facilities Equipment Engineer

Responsibilities:

• Project leader for the design and installation of complete reverse osmosis water system.
• Researched, designed, and procured paperless humidity data logging/alarm system.
• Issued a U.S. Governmental security clearance to possess and transport high explosives.

Confidential, Menlo Park, CA

Wire Harness Development Engineer

Responsibilities:

• Reduced department’s engineering drawing errors to below 1% by developing a drawing checklist.
• Project leader for two key customer accounts. Turned around the customers’ negative perceptions of Tyco's manufacturing quality by taking several trips to Mexico accompanied by the customer to demonstrate process improvements. This resulted in increased sales of $2M in 2008 and projected sales of $4M in 2009.

Confidential, San Jose, CA

Equipment Engineer

Responsibilities:

• Overcame challenges of working on dated equipment, often with no supporting documentation, schematics, passwords and manufacturers’ support. Refurbished two to three unfamiliar pieces of equipment weekly.

Confidential, Santa Clara, CA

Manufacturing Equipment Engineer

Responsibilities:

• Established foothold in new laser market by co-leading NPI of "Dirt Cheap Package" which decreased unit costfrom $300 down to $100, and received cash from CEO.
• Major contributor to the design and assembly of automated life test / burn-in rack. This test stationindividually addressed 256 slots at a temperature of 25-85c and used LabVIEW to operate. Designed cooling system for this machine including all of the pumping systems and temperature controls.
• Designed and built a universal high/low power laser bar test station.
• Set up acoustic microscopy application inspection process for optically pumped semiconductor solder process.
• This was a non-destructive underwater sonar defect imaging process.
• Significantly contributed to the design and layout of new class 1000 clean room.
• Developed fiber to snout hermetic seal soldering process for NPI of telecom tunable transmitter.
• Project leader for high speed wire bonding machine procurement, installation, and .

Confidential, Silicon Valley, CA

Engineering Support Technician/High Vacuum Specialist, Santa Clara Division

Responsibilities:

• Beam Tube Atomic Clock and Crystal / Oscillator departments. Created and set-up maintenance schedules for all f the assembly line equipment, including hydrogen/vacuum braze furnaces. Promoted Kanban methodologies.
• Researched, proposed, sourced and installed oil-free vacuum pumps into a manufacturing clean room that resulted in a hydrocarbon-free environment, thus decreasing product contamination.

Confidential

Programmer, Senior Technician, Optoelectronics Division

Responsibilities:

• Pioneered revolutionary method of removing defective III-V semiconductor material from light emitting diode finished wafers. This decreased hands-on time by 20%.
• Developed triangular surface mount light emitting diode “flop-chip” solder pad that increased solder yields by17%.
• Solely responsible for setting up and installing HP Optoelectronics Division’s first CAD/CAM department in the U.S. and Malaysia. Assumed full responsibility for transferring a complete machining center, including computers, peripherals, and software operation at Confidential 's Southeast Asia facility. Off shoring of the manufacturing operation reduced operating expenses by utilizing economies of scale.
• Collaborated on the design and development of the initial prototype and production "flop-chip" die attach machines. These machines were not commercially available and are capable of attaching 2.5 die per second.