Process Development Engineer Resume
Goleta, CA
Summary/Objective:
Obtain a position in Process/Development Engineering to utilize and grow my technical skills and also provide me with opportunities for advancement and personal development.
Experience in semiconductor (Si and GaN) manufacturing environment; strong analytical ability, excellent communication skills and innovative root cause problem resolution.
Experienced and detail knowledge of various semiconductors manufacturing processes i.e. Photolithography, thin film depositions (ebeam, sputtering and ALD), wet and dry plasma etches.
Experience in Statistical methods of data analysis (SPC and DOE).
Education:
B.S. Electrical Engineering
A.S. Engineering
Professional Affiliations:
- Institute of Electrical and Electronics Engineers (IEEE)
- Member of International Honor Society of the Two-year College
Technical Skills:
- Lean Manufacturing
- SPC (Statistical Process Control)
- DOE using JUMP(Design of experiment)
- Hardware:
- AMT and ASM reactor operation growing Epitaxial Silicon wafers
- Test equipments such as Oscilloscope
- Tools and Metrology equipments usage in Fab (Semiconductor)
- Language skills: English, French
- Behavioral: Strong team orientation, fast learner, communication skills
WORK EXPERIENCE:
Process Development Engineer October 2011 Present
Confidential, Goleta, CA
- Work with team of scientists, engineers, and technicians to develop fabrication processes for advanced GaN-based electronic devices.
- Conduct periodically qualification on tools, making sure that all measurements stay within the tools specs.
- Wafers disposition.
Senior Process Eng. Technician May 2010 September 2011
Confidential,Goleta, CA
- Worked as a Senior Process Eng. Technician in an early stage start-up company supporting R&D engineers and processing of semiconductor (GaN) in a clean room environment from the front-end to the back-end process. I’m certified in chemical wet etch and Dry etch; metal and dielectric deposition (e-Beam CHA, Sputter PERKIN 400, PECVD Novellus and ALD Oxford flexAl); Metal LIFT-OFF; Photolithography (Coat, Exposure, Develop, Overlay and Defect Inspections); Visual Defect Inspection using microscope; Metrology (AFM, Ellipsometer, Nanospec, Veeco Dektak Profiler) and Auto Probe (PCM, Switching and DC testing).
- Support Engineering and Development on an “as needed” basis to perform basic tests and non-standard processing.
- Conduct periodically qualification on tools, making sure that all measurements stay within the tools specs.
- I monitor and inspect product run operations, using metrology equipments and microscopes, to determine control and output quality of each process, and where applicable, isolate any spec violation issues and tolerance margins.
Semiconductor Technician II Feb 2009 Apr 2010
Confidential, Redmond, WA
- First, I worked as a contractor for Manpower and became a permanent full time employee for Honeywell, worked in a clean room environment under the MEMS division. Perform various silicon and glass wafer processing steps as assigned; include working with hazardous chemicals, operating and maintaining complex automated equipment used in production of silicon wafers. I’m certified in chemical wet etch and cleaning; EDP; metal LIFT-OFF; PROBE (Wafer test); EVG 520 and EVG 620 (Wafers Bonding).
- I monitor and inspect product run operations to determine control and output quality of etch procedures, and where applicable, isolate any spec violation issues and tolerance margins.
Production Specialist May 2007 Jan 2009
Confidential, Gresham, OR
- As a production specialist I drove quality controlled production in etch department (200mm wafer fabrication facility). I have operated complex equipment and tooling for wafer fabrication and certified in the functional use of the following tools: LAM Alliance 9400PTX Etcher; LAM Alliance 9600 (Metal Etch) PTX Etcher: TEL DRM and PE Plasma Etcher; Fusion Gemini UV Bake; Semitool SST; RUDOLPH and Hitachi CD SEM.
- I monitored and inspected product run operations to determine control and output quality of etch procedures, and where applicable, isolate any spec violation issues and tolerance margins.
Machine (Reactor) Operator March 2006 May 2007
Confidential,Vancouver, WA
- Worked for Volt services as a machine (reactor) operator at SEH-A in a clean room environment under the Epitaxial department.
- Operated reactors (AMT and SMT) used in the production of silicon wafers
- Worked from product specifications to perform production tasks and drive quality output
- Checked and inspected operation against predetermined tolerances and specifications
- Drove quality improvement metrics up by 10% from baseline
ACHIEVEMENTS/AWARDS:
- Member of International Honor Society of the Two-Year College (PHI THETA KAPPA)